Study the performance analysis of carbon nanotube bundle interconnects

Abstract

ABSTRACT Interconnect delay is a major factor determining the performance of VLSI circuits. As technology scaled down, interconnects delay dominates the gate delay. CNTs are susceptible to electro migration problems that plague the copper interconnect. Due to high thermal conductivity and large current carrying capacity CNTs are preferred over copper as VLSI future interconnects. In this dissertation, performance of CNT as a VLSI interconnect has been studied and results are compared with existing copper interconnects at 32nm technology node. The effects of various parameters such as interconnect length, number of repeater and size of driver transistor on propagation delay and on crosstalk noise have been analysed. The normalized crosstalk noise is evaluated for carbon nanotube interconnects using SPICE simulation. SPICE simulation result reveals that normalized crosstalk noise increases with increase in length of interconnect and decreases with number of repeaters. The study reveals that bundle of CNT interconnect model gives better result as compared to copper in deep submicron technology for semi global and global length of interconnects.