GENAI POWERED DESIGN VERIFICATION

dc.contributor.authorSingh, Varsha
dc.contributor.supervisorUpadhyay, Rahul
dc.contributor.supervisorChandwani, Geetanjali
dc.date.accessioned2025-08-04T08:21:08Z
dc.date.available2025-08-04T08:21:08Z
dc.date.issued2025-08-04
dc.description.abstractIn nowadays changing semiconductor industry, precision is very important for designers, verification engineers, and layout professionals. Due to the high costs and tight schedules involved in chip design, verification, and fabrication, achieving success in first time is important. But this level of accuracy is difficult to get and without a well defined methodology guiding the entire ASIC development process is difficult. Without skilled engineers, rtl design engineers the success in this semiconductor industry is very tough. The increasing design complexity is one of the most major challenge in semiconductor industry nowadays. Many traditional approaches are there but they are very much time taking and inefficient. Compared to the, Artificial Intelligence provides automated and vast number of solutions by reducing manual efforts. After the arrival of GENAI driven techniques, verification process has been made easier and lots of manual efforts have been reduced. This change in semiconductor industry not only increases the verification abilities of engineers but also reduces time required in overall manufacturing cycle to a great extent.en_US
dc.identifier.urihttp://hdl.handle.net/10266/7050
dc.language.isoenen_US
dc.subjectArtificial Intelligenceen_US
dc.subjectSemiconductorsen_US
dc.subjectChip Designen_US
dc.subjectVerificationen_US
dc.subjectBlack Boxen_US
dc.titleGENAI POWERED DESIGN VERIFICATIONen_US
dc.typeThesisen_US

Files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
602362040_Varsha Singh_MTech Thesis.pdf
Size:
1.84 MB
Format:
Adobe Portable Document Format
Description:
VLSI MTech Thesis

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
2.03 KB
Format:
Item-specific license agreed upon to submission
Description: