Through Thickness Residual Stress Distribution During Cold Rolling of Titanium Alloy (Commercial Pure)
| dc.contributor.author | Singla, Ayush | |
| dc.contributor.supervisor | Kumar, Gulshan | |
| dc.date.accessioned | 2017-09-11T09:55:24Z | |
| dc.date.available | 2017-09-11T09:55:24Z | |
| dc.date.issued | 2017-09-11 | |
| dc.description | Master of Engineering -Production Engineering | en_US |
| dc.description.abstract | The main objective of the present dissertation was to observe through-thickness gradient in microstructure and residual stress in titanium alloy (Grade-2) during cold rolling. Cold rolling can be used in order to modify material properties during deformation. The above characteristics were examined using EBSD technique and X-ray diffraction. It was found that rolling leads to microstructure refinement and lowering of residual stress. Maximum compressive residual stress was found to be at top surface (T0) which goes on decreasing as we move towards middle of the specimen. At middle of the specimen (T/2) stresses are near to zero. To confine such through thickness deformation gradients a deformable FE (finite element) model was developed. Conformity was observed between the experimental and the simulation residual stress distributions. Through-thickness residual stress evolution was then extended to see the effect of rolling parameters such as (coefficient of friction and rotational speed). With increasing coefficient of friction and the rotational speed residual stress was increased. | en_US |
| dc.identifier.uri | http://hdl.handle.net/10266/4854 | |
| dc.language.iso | en | en_US |
| dc.subject | Titanium Alloy (Commercially-Pure) | en_US |
| dc.subject | Cold Rolling | en_US |
| dc.subject | X-Ray Diffraction (XRD) | en_US |
| dc.subject | Electron Back Scatter Diffraction (EBSD) | en_US |
| dc.subject | Finite Element Method (FEM) | en_US |
| dc.title | Through Thickness Residual Stress Distribution During Cold Rolling of Titanium Alloy (Commercial Pure) | en_US |
| dc.type | Thesis | en_US |
