Design and Analysis of Heatsink for Split Air Conditioner

Abstract

The advancement of the Air conditioner and their utilization is rapidly increasing day by day. But the reliability of electronic components is critically affected by the temperature at which the junction operates. So, for cooling the electronic devices heatsinks are used. In the air conditioner, the heatsink is used to cool down the PCB (which is the brain of the Air conditioner). The main focus of this project is to design a better Heatsink than the previous one that is used in LG. As the previously used heatsink causes faulty errors in the PCB. While checking by the field engineer it was found that the Heatsink temperature is high which causes short-circuiting in the IPM chip which is placed below the heatsink. As heatsinks main function in PCB (printed circuit board) is to cool down the main four chips which are IPM, IGBT, FR, and Bridge Rectifier. The finest Heatsink for effective cooling of PCBs will be shown in this study. The selection of the best heatsink depends on a variety of geometric factors, including the height of fin, number of fins, baseplate thickness, shape of fins, and material. As a result, preliminary research on the fluid flow and heat transfer properties of common continuous heatsinks of various designs has been conducted through CFD simulations. The results show that a heatsink design with rectangular fins and holes produces the best cooling, however, we are unable to employ perforated heatsinks because of their high manufacturing costs. But in the future, if some advancement in the manufacturing field takes place and the cost of perforated fin decreases then it might be considered for use in HVAC heatsinks. For this reason, we go towards the Plate Fin heatsink as its manufacturing cost is the least and most easily available in the market. An experimental approach also takes place from which we can validate our result.